Scalable, layered acoustic wave micro-chips withstand >12X higher power loads/ handle high-power RF signals with minimal insertion loss
https://www.eurekalert.org/news-releases/1136909 "these RF front-end filter chips previously restricted to low-power, small-signal processing... overcome optimizing thermal dissipation/ mechanical stress distribution enabling acoustic components vibrating 100s of millions times/ second to maintain cooler, stable operation under heavy electrical strain... direct-to-cell satellite communications, high-frequency 6G, smartphones, compact power conversion modules"