Micro-transfer printing allows scalable heterogeneous materials like indium phosphide, lithium niobate to integrate onto CMOS photonics

https://www.eurekalert.org/news-releases/1136625

"overcomes primary bottleneck in optical interconnects for AI, using elastomeric stamp to pick up densely fabricated thin-film device coupons from source wafer/ transfer onto target silicon photonics platform using adhesive or direct bonding... allows diverse functional materials to be independently optimized before co-integration onto single CMOS chip... future: solve yield/ manufacturing throughput challenges... high-bandwidth telecom, datacom, and quantum applications"