Dry van der Waals lamination squeezing out interfacial polymers/ contaminants, atomically cleaning 2D semiconductor heterostructures

https://www.eurekalert.org/news-releases/1137517

"transfer processes during 2D electronics assembly use organic sacrificial polymers leaving trapped micro-bubbles, interfacial polymer residues, airborne hydrocarbons, nm-scale contaminants, degrading charge carrier mobility/ layer-to-layer contact quality... overcome controlling mechanical pressure/ lamination dynamics across atomically flat surfaces, improving device-to-device uniformity/ enhancing electronic performance... scalable manufacturing route for: wafer-scale 2D transistors, vertical 3D ICs"