Bombarding liquid tin micro-droplets with laser pulses generates extreme UV, optimizing sub-3 nm semiconductor manufacturing yields

https://www.eurekalert.org/news-releases/1134857

"unpredictable tin debris/ propulsion variations cause engineering bottlenecks, overcome mapping-out tin micro-droplets' hidden flow when struck by high-power laser pulses creating plasma necessary for EUV light... optimized light's stability/ intensity based on droplet deformation, propulsion, mass distribution, improving chipmaking yield/ efficiency... next-generation lithography systems with superior throughput and reliability"

Related: 3D-printed copper water cooling system assisted fabrication of 10.6-μm high-power CO2 laser resistance reflectors
https://www.eurekalert.org/news-releases/1144962