Posts

Showing posts from June, 2026

Ultra-precise laser-based process alters materials at microscale, slashes production costs, accelerates scaling for high-performance optics

https://www.eurekalert.org/news-releases/1130186 "photonics assembly: painstaking manual calibration or expensive active alignment hardware >half of production costs... overcome embedding passive alignment features into optical glass components, achieving sub-micron tolerances... faster, cheaper, inherently precise assembly... advancement is positioned to rewrite assembly rules for a wide array of next-generation technologies, including quantum computing setups, optical communications networks, and advanced medical diagnostics"

Record 450 Tbps data transmission across existing, legacy metropolitan fiber-optic infrastructure

https://www.eurekalert.org/news-releases/1130094 "speed records require ideal, low-loss laboratory fibers, overcome with optical-amplifier utilizing O-, E-, S-, C-, L-bands simultaneously, expanding usable transmission signal to record 42.4 THz, >4X conventional capacity... practical method for massively scaling data networks to support demanding AI and cloud services using already-installed physical infrastructure with only minor hardware updates... internet/ data center networks"

Dynamically controlling optical programming of 2D semiconductors' material properties without doping, for 63X increased performance

https://www.eurekalert.org/news-releases/1130313 "2D molybdenum disulfide vulnerable to structural defects/ difficult to engineer, so chemical doping complex/ destructive, overcome using optical-only doping using Laser-Assisted Microlens Array Processing: continuous wave laser passes through self-assembled microparticle layer focusing laser beyond light's diffraction limit, safely creating localized sulfur vacancies achieving stable, non-volatile n-type doping without impurities/ area destruction... high-density, efficient, scalable 2D CMOS" Related:  Streamlined, single-step laser manufacturing a photoelectric conversion junction inside a 2D semiconductor layer https://www.eurekalert.org/news-releases/1130314