Heterogeneously merging 2D tin disulfide/ silicon-on-insulator micro-ring resonator to perform optical signal modulation/ photodetection

https://www.eurekalert.org/news-releases/1137627

"photonic interconnects require separate optical modulation/ photodetection components, increases total chip size, packaging complexity, energy consumption... overcome exploiting disulfide layer's strong light-matter interaction/ gate-tunable absorption, toggling light modulation/ optical signal detection... high modulation depth alongside sensitive phototransduction across standard optical communication wavelengths... scalable, high-density, compact, low-power, co-packaged electro-optic device"