Tuning interfacial thermal resistance across 2D heterostructure boundaries turn passive heat barriers into directional thermal conductors

https://www.eurekalert.org/news-releases/1137340

"2D interfaces treated as passive boundaries by semiconductor packaging, trapping localized heat/ degrading performance... overcome continuously tuning interface synthesis: twist angle, mechanical strain, ion intercalation, enabling boundaries evolving into active thermal functional components: directional heat conductors, thermal switches, thermal transistors... eliminates hotspots in high-density sub-2nm 3D integrated circuits"