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Showing posts from August, 2025

Neural network inserts new light sources into photographs and has them interact realistically with the scene to create re-lit images

https://www.eurekalert.org/news-releases/1093415 "enables lighting changes after the fact instead of buying expensive lighting gear/ reshooting scenes... estimates 3D version of scene representing shape/ surface colors, intentionally leaving out any lighting... then place in/ interactively simulate virtual light sources creating rough preview which neural network can transforms into realistic photograph... control like a graphic arts program, but on existing photographs... future: extend functionality to videos without having to resort to using a generative AI model"

Catalyst combines acid and base sites in a single, reusable structure, eliminating side reactions/ boosting efficiency in lithium-ion batteries

https://www.eurekalert.org/news-releases/1093350 "scalable: streamlines manufacture of Ethyl methyl carbonate which comprises 30–35% of electrolyte...  strong acid catalysts causes hydrolyzation into methanol/ carbon dioxide, while alkaline catalysts poorly soluble, leading to low conversion rates and wasted resources... overcome using [DBU+][IM-]@UiO-66 acid-base bifunctional catalyst creating synergistic environment... 62% yield, 99.5% selectivity, meaning nearly all reactants converted... yield only dropped slightly from 62% to 58.9% after six reuse cycles"

High-quality thin film/ high-performance optoelectronic device fabrication at lower temperature by precise control of hydrogen dilution ratio

https://www.eurekalert.org/news-releases/1093100 "amorphous silicon optoelectronic device with minimal defects at low 90°C (60% cooler) by controlling hydrogen to silane gas ratio enabling fabrication of flexible sensors that detect light/ convert it into electrical signals... requires precise thin films deposition on thin, bendable, heat-sensitive substrates... applying hydrogen passivation enhances electrical performance, minimizes thin-film defects... utilizes photoresist sacrificial layer... no complex plasma etching processes... wearable electronics, image/ optical sensors”