Micro-architecture/ surface coating 2-phase liquid-cooling drastically lowers high-density AI data center energy costs/ water consumption

https://www.eurekalert.org/news-releases/1151093

Summary: . Cheaper and more efficient AI data center cooling by optimizing boiling heat transfer coefficients directly at processor chip interfaces, removing extreme thermal loads efficiently without requiring energy-intensive mechanical chillers or massive cooling towers. This direct-to-chip thermal management platform provides data center operators scalable hardware retrofits to support next-generation high-wattage AI compute clusters sustainably.