Vapor-clearing microfluidic chip channels cool powerful chips with less risk of short circuits from trapped gas bubbles
"obstacles: critical thermal throttling limit/ dielectric fluid less effective heat dissipation than water...
overcome improving direct, low-risk, 2-phase, electrically insulating non-conductive dielectric fluid cooling... integrates horizontal-up manifold directly into chip substrate, achieving up to 1,570 W cm⁻² critical heat flux... horizontal inlets deliver coolant near hot spots, phase-change absorption enables heat boil-off/ vertical outlets evacuate... high-density AI processors, high-performance computers"
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