Automated, high-precision alignment/ packaging lowers manufacturing costs/ boosts optical yield for integrated photonic microchips

https://www.eurekalert.org/news-releases/1147562

"optical fiber-to-chip packaging/ coupling bottlenecks and issues with insertion loss, bandwidth, environmental stability prevent photonic AI accelerator/ optical interconnect scaling... overcome using advanced optical coupling (2-photon polymerization/ self-written waveguides) improving alignment tolerances/ lowering manufacturing expenses, as well as automated assembly, inverse-designed structures, AI-driven optimization... telecommunications, quantum computing, biomedicine, aerospace"