Converting frictional heat into a chemical protective layer prevents structural defects during bulk semiconductor crystal growth

https://www.eurekalert.org/news-releases/1144159

"diamond tools leave deep microcracks in hard semiconductor ingots, overcome: introducing liquid polymer coolant containing non-toxic azo compound additive, then when crystal struck, localized friction heats instantly >45°C, causing additive to release free radicals reacting with surface silicon atoms... creates pliable, 10-nm-thick amorphous cushion layer that deforms smoothly/ nearly doubles crack-free cutting depth... faster, higher-yield EV/ clean energy grid 8" silicon/ wide-bandgap chip wafer production"