BBCube bumpless chip-on-wafer/ through-silicon vias increase aggregate signal bandwidth up to 16X and reduce thermal resistance 52%

https://www.eurekalert.org/news-releases/1139555

"AI accelerators exhibit memory bandwidth/ thermal dissipation bottlenecks, overcome delivering crucial 2.5D /3D advanced semiconductor packaging... high-precision face-down chip-on-wafer placement, bumpless chip interconnections, multiscale thermal analysis... via-last through-silicon vias eliminate metallic solder bumps, achieving 10 µm chip-to-chip spacing... high signal quality... waffle wafer heat mitigation evaluated at 1-µm resolution across 100 million analysis points"