High-bandwidth, low-loss electronic/ photonic integrated circuits optically interconnected on a single platform without wire bonding

https://www.eurekalert.org/news-releases/1128668

"created using reconfigurable germanium–silicon photodetector utilizing fan-out wafer-level packaging... significantly reduces parasitic loss/ improves signal integrity... redistribution layer: dense (>10² connections/ square mm) network of fine metal interconnects, <0.3 dB/mm insertion loss at 100 GHz,  >110 GHz device bandwidth, highly efficient optical-to-electrical conversion, low-noise... ultrahigh-speed data transmission across multiple modulation formats ranging from 112 to 336 Gbps/ wavelength"