Thin-film survives harsh plasma etching and acts as a superior lithography mask, for smaller/ more advanced semiconductor chips
"etching extremely deep/ narrow structures into silicon using high-energy plasma can damage masks patterning chips, distorting patterns... resolved using atomically thin 2-D material with very high-aspect-ratio structure for advanced chips... significantly improves fabrication of next-generation semiconductors by: maintaining sharp nanoscale patterns even in harsh processing conditions enabling smaller (supports Moore’s law), more precise chip features, improving manufacturing reliability"
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