Using 2D dielectric insulators made of lightweight carbon COFs enables AI/ conventional electronic chips to run significantly cooler/ faster

https://www.eurekalert.org/news-releases/1108208

"low: power consumption/ signal interference (cross talk)... created from carbon and other light elements to form covalently bonded, highly porous crystalline sheetlike films... ultralow dielectric constant/ ultrahigh electrical breakdown strength (needed for high-voltage), good thermal stability... synthetic interfacial polymerization stitches molecular building blocks to form strong crystalline layered sheets.... ultimate goal is to greatly lower the power consumption of the booming AI data center growth"