U.S.- built monolithic 3D chip offers significantly improved performance over traditional 2D chips and promises to advance AI hardware

https://techxplore.com/news/2025-12-monolithic-3d-chip-built-foundry.html

"stacks ultra-thin memory/ computing units vertically, enabling fast, massive data movement between layers... layers built 1 on top of other in continuous, low-temperature process in commercial foundry... helps chip bypass the bottlenecks that have long slowed improvement in flat designs... outperforms comparable 2D chips 4X, up to 12X improvement on real AI workloads... 100 to 1,000X improvements in Energy-Delay Product metric balancing speed and energy efficiency"

Related: CityUHK pioneers breakthrough in 3DIC semiconductor packaging materials
https://www.eurekalert.org/news-releases/1109660