Glue-free direct bonding of two 2D semiconducting wafers eliminates need for intermediate materials which can contaminate interface

https://techxplore.com/news/2025-11-approach-bond-debond-2d-semiconductors.html

"layers brought into contact within vacuum or glovebox, they bond naturally... allows for: precise manipulation of layer numbers/ interlayer twist angle, consistent results across large areas, reversible assembly... proof of concept: homostructures/ heterostructures using molybdenum disulfide and molybdenum diselenide monolayers... dielectric integration while preserving intrinsic electronic properties... smaller, faster, higher-performing electronic components, such as advanced transistors"