Overcoming heat dissipation difficulties of co-packaged optics increases speed/ energy savings, benefiting data center optical interconnects

https://www.eurekalert.org/news-releases/1090356

"optical/ electronic devices working together in same tiny package enables short signal transmission distance... thermal management difficulty overcome, efficiently cooling high heat flux switch chip/ avoiding high temperature generated by switch chip from affecting surrounding optical modules/ ensuring temperature homogeneity between surrounding optical modules to avoid signal crosstalk... can be applied to heat dissipation of 51.2 Tbit/s co-packaged optics... data center optical interconnects"