Low-cost, scalable integration of high-speed gallium nitride transistors onto standard 3D silicon chips enables faster, more energy-efficient devices

https://www.eurekalert.org/news-releases/1088085

"high cost of gallium nitride semiconductor and its fabrication into devices, overcome by building many tiny transistors on GaN chip surface, cutting out each individual transistor, then bonding just necessary number onto silicon chip at low-temperature... cost minimal since only tiny amount of GaN material added to chip, but device receives significant performance boost while reducing overall operating temperature... smartphones with improved call quality, boosted wireless bandwidth, enhance connectivity, long battery life"