IBM Research advancements in chip assembly/ packaging deliver high-speed connectivity to supercharge generative AI computing

https://research.ibm.com/blog/co-packaged-optics-to-supercharge-generative-ai-computing#pageStart

"fiber optic speed/ capacity inside data centers/ circuit boards... improved bandwidth: 6X increased beachfront density... polymer optical waveguide... >80% reduced energy consumption,,, reduction from 5 pJ/ bit to <1...<0.5 µm tolerance between fiber/ connector achieved... 50- µm pitched optical channels, coupled to silicon photonics waveguides/ connector pluggable to single mode glass fiber arrays... 80% size reduction from conventional 250 (future: 20 or 25) µm pitch”