Micro-transfer printing for heterogeneous Si photonic integrated circuits

https://techxplore.com/news/2023-06-micro-transfer-heterogeneous-si-photonic-circuits.html

"micro-transfer printing combines advantages die-to-wafer bonding integration with those of flip-chip integration (pre-fabrication and pre-testing of the nonnative components, high alignment accuracy integration, no disruption of silicon photonics (SiPh) process flow... heat and bumps form solder balls conduct electricity... waveguides connecting photonic chips either fabricated at same time rest of devices... 1 μm lateral alignment tolerance. Scaling up the technology to 200 mm and 300 mm wafers underway"