Advancing photonic integrated circuit packaging in Europe

https://www.laserfocusworld.com/optics/article/14295556/advancing-photonic-integrated-circuit-packaging-in-europe

"signal and power distribution, optical performance, thermal effects, mechanical, electrical, and environmental protection... die bonding, polishing, active alignment, hermetic sealing... batch-level automation... fiber array self-alignment and attachment, polymer tapered micro-optics and embedding detectors, edge-emitting-lasers, vertical-cavity surface-emitting lasers, transition edge sensors and single-photon detectors... 3D printing directly onto photonic chips both chip and wafer levels"