Polymer-based thermal interface material significantly enhances heat dissipation in high-power AI processors

https://www.brightsurf.com/news/LDE0VMK8/new-polymer-thermal-gel-may-improve-cooling-for-next-generation-ai-chips.html

"thermal greases/ gels often degrade, dry out, fail to fill microscopic gaps between chips/ cooling components under prolonged high-temperature... overcome synthesizing flexible polymer gel maintaining exceptional thermal conductivity while structurally adapting to micro-irregularities without cracking/ leaking... drastically lowers operational temperatures preventing thermal throttling... cost-effective for sustaining intense processing demands of next-generation data centers and edge AI units"

Related: ‪MIT's spinnoff Ferveret reduces energy and water used to cool the chips that power
https://news.mit.edu/2026/nuclear-inspired-cooling-system-ferveret-could-make-data-centers-more-sustainable-0610