Overcoming trade-off between speed and thermal stability in 120 nm short-channel top-gate amorphous indium tin oxide semiconductors

https://techxplore.com/news/2025-10-super-thin-semiconductor-thermal-stability.html

"high-speed, high-frequency, low-cost, low-temperature, large-area, chip-compatible processing with high carrier mobility, but thermal conductivity inherently low... overcome using high-thermal-conductivity silicon carbide substrate for power amplification above 10 GHz RF, also in DC current... eliminates self-heating even under 3V/ 125°C... future: thin-channel materials for back-end-of-line-compatible electronics, enabling scalable/ energy-efficient RF integration... high-speed: RF power amplifiers, data communications"