Heat fluxes up to 3,000 W cm−2 in silicon substrates cooled using little pumping power; scalable 3-layer device uses existing fabrication processes

https://techxplore.com/news/2025-10-layer-microfluidic-cooling-device-small.html

"3-layers each etched into silicon substrate's back: tapered manifold ensuring even coolant distribution (top), microjet shooting coolant up onto chip's surface (middle), etched microchannel with sawtooth-shaped sidewalls carrying warm coolant out (bottom)... single-phase water pumping uses only 0.9 W cm−2 power... up to 13K coefficient of performance and 1K W cm−2 heat flux dissipation at 65°K maximum chip temperature rise... removes heat significantly more effectively than most previously introduced strategies"