Devices electronicly cool at up to 3kW/ cm−2 heat dissipation with 3-tiered structure in single-phase integrating of microfluidic components

https://bioengineer.org/high-performance-microchannels-for-electronic-cooling-solutions/

"microchannel cooling boosts longevity/ performance... coolant channel (tapered manifold) top layer directs water down to microjet layer directing coolant down to sawtoothed sidewall microchannels maximizing surface area contact between coolant/ heated surfaces... low thermal resistance manages elevated temperatures without overheating/ failure, low 0.9 W/ cm−2 pumping power need minimizes cooling system component wear... MEMS fabrication on silicon substrate... telecommunications, AI, renewable energy"