Low-temperature, quicker nanocrystalline direct copper-to-copper bonding advances next-gen electronic chip packaging manufacturing

https://techxplore.com/news/2025-01-temperature-copper-bonding-advances-gen.html

"valuable for industrial mass production... overcomes many grain boundaries where impurities tend to concentrate, with gentle heating grains grow on the top surface but not bottom... strategic dual-layer design where coarse-grain layer impurity sink, preventing void formation near copper seed layer.... Nanocrystalline copper over coarse-grain layer... integrate different types of chips—especially those sensitive to heat—into compact, high-density 3D structures... AI, 5G networks, AR, VR"