Scalable fabrication of copper foil to simultaneously exhibit strength, conductivity and thermal stability

https://www.globaltimes.cn/page/202604/1359254.shtml

"stronger copper usually requires adding alloys like beryllium, but blocks electron flow... high conductivity requires high purity, but softens/ weakens... small copper grains grow/ merge when heated causing weakness over time... overcome embedding 3 nm structures throughout, pinning copper’s grain boundaries in place providing: 2X strength, no strength degradation after 6+ months (thermal stability), only slightly reduced conductivity (electron scattering minimized)... batteries, AI hardware, aerospace"