Packaging photonic chips to operate reliably in high heat, ultracold, vacuum, radiation, and space

https://www.eurekalert.org/news-releases/1121992

"polymer adhesives in chip/ optical fiber connection cracks in extreme cold, degrades under radiation/ heat, fails in vacuum, overcome using hydroxide catalysis bonding creating glass-like molecular bond... quantum computing systems (ultracold + vacuum), space missions, nuclear reactors, industrial/ energy applications... limitation: bonding currently takes several days, but with engineering likely sped up for mass production... high-speed, energy-efficient photonic chip operation in extreme environments"

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https://phys.org/news/2026-07-highly-liquid-epoxy-smaller-reliable.html