Deep-trench 3D printing fabricates next-gen RF devices comprised of 1:4 aspect ratio microstructures with sub-10 micron resolution

https://www.eurekalert.org/news-releases/1082791

"combining 2-photon polymerization, electroplating, dry etching... ultra-compact RF resonators with tunable frequencies between 4–6 GHz... trenches in photoresist layer filled with thick (up to 8 µm) copper through electroplating, dry etching removes seed layers, yielding freestanding metal structures with flat, vertical sidewalls... increasing metal thickness improves Q-factor 6 to 7X, resonance frequencies shifted up to 200 MHz, allowing precise tailoring for specific RF applications... sensing, MEMS, RF metamaterials"