Researchers use 2D material to reshape 3D electronics for AI hardware

https://techxplore.com/news/2023-11-2d-material-reshape-3d-electronics.html

"fully integrating many functions into small monolithic 3D chip containing 6 atomically thin 2D layers, each with own function... tightly packed processing layers ensure dense interlayer connectivity. As a result, the hardware offers unprecedented efficiency and performance in AI computing tasks... compact, powerful, energy-efficient, flexible, faster processing, enhanced security, reduced latency... expand AI system capability, autonomous vehicles, medical diagnostics, data centers, in-sensor computing"