BBCube 3D: Implementing CPU/GPU and memory in a hybrid 3D approach

https://techxplore.com/news/2023-06-bbcube-3d-cpugpu-memory-hybrid.html

"better integration between PUs and DRAM... compact architecture, no solder microbumps, and the use of TSVs in place of longer wires, together contribute to low parasitic capacitance and low resistance... 4-phase shielded input/outputs... noise resistant... adjacent IO lines timing always out of phase reduces crosstalk... 1.6 TB p/s bandwidth 30X higher... low thermal resistance and impedance, thermal management and power supply issues relieved... bit access energy bandwidth 1/20th and 1/5th DDR5 and HBM2E"

Related:

Intel reports high-rendering graphics with low-power GPUs

https://techxplore.com/news/2023-07-intel-high-rendering-graphics-low-power-gpus.html

3D DRAM Is Coming. Here’s a Possible Way to Build It

https://newsroom.lamresearch.com/3D-DRAM-architecture-proposal