Improved reliability of printed circuit boards

https://techxplore.com/news/2022-11-reliability-circuit-boards.html

"eliminates void spaces common reason for printed circuit board failure... reduce by factor of 20 extent surface roughening of copper surface onto which microvias deposited... not use nickel reductant... hydrogen bubbles did not disrupt integrity of copper–copper interface... deposition epitaxial... delamination, cracking, and other failures are less likely... improving electrical interconnects in high-density circuitry, in manner that does not substantially change well-established, trusted protocols"