Graphcore Uses TSMC 3D Chip Tech to Speed AI by 40% Unveils plan for $120-million “brain-scale” supercomputers in 2024

https://spectrum.ieee.org/graphcore-ai-processor

"The new combined chip, called Bow, for a district in London, is the first on the market to use wafer-on-wafer bonding... addition of the power-delivery silicon means Bow can run faster—1.85 gigahertz versus 1.35 GHz—and at lower voltage than its predecessor. That translates to computers that train neural nets up to 40 percent faster with as much as 16 percent less energy compared to its previous generation. Importantly, users get this improvement with no change to their software at all"