AI computer maker Graphcore unveils 3-D chip, promises 500-trillion-parameter 'ultra-intelligence' machine

https://www.zdnet.com/article/ai-computer-maker-graphcore-unveils-3-d-chip-promises-500-trillion-parameter-ultra-intelligence-machine/

"two die stuck together will speed performance by 40%... EfficientNet... melding two wafers before the wafers are cut into separate die... joins the metal circuitry of each wafer. The top wafer is then shaved down to a very thin, film-like quality that is "floppy." The bottom wafer carries the structural support for the two... extremely high density of interconnect between the two wafers... It is more sophisticated than typical "chip on wafer"... wafer-on-wafer achieves ten times the density of interconnects"